连续不断
发表于 2025-3-21 19:12:32
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防御
发表于 2025-3-22 00:04:02
1935-3235 tions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative desi
dowagers-hump
发表于 2025-3-22 01:31:28
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cornucopia
发表于 2025-3-22 08:35:14
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Interlocking
发表于 2025-3-22 10:56:44
1935-3235 o designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.978-3-031-00619-7978-3-031-01747-6Series ISSN 1935-3235 Series E-ISSN 1935-3243
歌唱队
发表于 2025-3-22 15:39:35
Kenneth B. Gordon,Eric M. Rudermanromising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.
歌唱队
发表于 2025-3-22 17:30:49
Conclusion,romising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.
medieval
发表于 2025-3-23 01:15:13
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cuticle
发表于 2025-3-23 03:57:50
Coarse-granularity 3D Processor Design,as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such
是剥皮
发表于 2025-3-23 05:40:39
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