麻烦
发表于 2025-3-21 16:51:03
书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0278421<br><br> <br><br>书目名称Die-Attach Materials for High Temperature Applications in Microelectronics Packaging读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0278421<br><br> <br><br>
积习难改
发表于 2025-3-21 22:55:45
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铁砧
发表于 2025-3-22 00:54:10
Process Control of Sintered Ag Joint in Production for Die Attach Applications,eps require additional care because of the absence of self-alignment and ability to rework in a solid-state sintering process. In addition, the measurement of nano-sized porosity and voids is also crucial to control properties of the sintered Ag joint, such as density, thermal conductivity, and ther
handle
发表于 2025-3-22 04:44:04
Thermomechanical Modeling of High-Temperature Bonded Interface Materials,lar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature a
Migratory
发表于 2025-3-22 09:25:27
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DECRY
发表于 2025-3-22 13:52:59
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DECRY
发表于 2025-3-22 20:45:45
Die-Attach Materials for Extreme Conditions and Harsh Environments, very long service periods, spanning 5–20 years of operation and in harsh environments, with equipment exposed to challenging environmental conditions with high temperature, shock, and vibration. For downhole reservoir well construction and production equipment, it is paramount to maximize efficienc
Banquet
发表于 2025-3-22 23:06:01
Michael Ruzhansky,Ville Turunent interfaces. Therefore, silver sintering joint may possess porosity, which greatly reduces its bulk mechanical properties such as elastic modulus, yield strength, strength to failure, ultimate tensile strength, and Poisson’s ratio, as well as its thermal and electrical conductivities.
conifer
发表于 2025-3-23 02:17:54
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Tincture
发表于 2025-3-23 06:25:45
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