遵循的规范 发表于 2025-3-23 09:45:08
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https://doi.org/10.1057/9781137437204Postdigital; digital; art; computation; design; post-internet; aesthetics; glitch; media; theory; software; tec剧毒 发表于 2025-3-23 18:47:41
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Copper–Tin Reactions in Thin-Film Sampleshe size of the solder bump. This is because the oxide on a free Al surface prevents the wetting of molten solder. On the other hand, Cu reacts extremely fast with molten solder, therefore the Cu thin-film wiring cannot be wetted by molten solder.Inordinate 发表于 2025-3-24 03:25:32
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James Henderson,Slavo Radosevicmeter changing from micron- to nanoscale using various polymer types and their blends. Recently, multi-axial electrospinning technique incorporating additional walls in electrospun fiber structures in a single-step process resulted in new generation fibers with unique architecture and morphology. Thobviate 发表于 2025-3-24 10:47:45
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