Insularity 发表于 2025-3-21 19:40:23

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不开心 发表于 2025-3-21 20:26:02

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forebear 发表于 2025-3-22 02:46:47

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Commonwealth 发表于 2025-3-22 05:06:58

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碳水化合物 发表于 2025-3-22 08:52:05

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蚀刻术 发表于 2025-3-22 15:56:34

1558-9412 e important issues, tradeoffs, and techniques in coupled datWafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale in

蚀刻术 发表于 2025-3-22 20:46:28

Book 2010 just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than

言外之意 发表于 2025-3-23 00:57:03

Power delivery, signaling and cooling for 2D and 3D integrated systems

Detonate 发表于 2025-3-23 03:58:10

Use of AC Coupled Interconnect in Contactless Packaging

量被毁坏 发表于 2025-3-23 07:36:28

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查看完整版本: Titlebook: Coupled Data Communication Techniques for High-Performance and Low-Power Computing; Ron Ho,Robert Drost Book 2010 Springer-Verlag US 2010