太平间
发表于 2025-3-21 18:01:43
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烧瓶
发表于 2025-3-21 20:57:52
Atomistic Simulations on Reliability,te length is aggressively scaled, have recently been researched as a major cause of reliability degradation observed in intra-die and die-to-die threshold voltage variation on the same chip resulting in significant variation in saturation drive (on) current and transconductance degradation—two key m
责难
发表于 2025-3-22 02:05:52
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Affection
发表于 2025-3-22 06:10:59
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GET
发表于 2025-3-22 09:36:44
Circuit Resilience Roadmap,us noise sources, and (b) an increase in parametric variability. This chapter examines the issue of circuit resilience by studying ongoing trends in technology scaling. Additional experiments with basic circuit blocks, such as memory or logic cells, reveal insights into their behavior for future tec
挖掘
发表于 2025-3-22 16:10:49
Layout Aware Electromigration Analysis of Power/Ground Networks, parameters affecting EM wire lifetime and we introduce some background related to the existing EM physical simulators. In our work, for EM physical simulation we adopt the atomic concentration balance-based model. We discuss the simulation setup and results. We present VEMA—a variation-aware electr
挖掘
发表于 2025-3-22 18:58:35
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Integrate
发表于 2025-3-22 21:50:52
Soft Error Rate and Fault Tolerance Techniques for FPGAs,vironment. This chapter will present a set of fault mitigation techniques for SRAM, FLASH and ANTIFUSE-based FPGAs and a test methodology to characterize those FPGA under radiation. Results from neutron-induced faults will be presented and compared.
易于
发表于 2025-3-23 02:37:48
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纪念
发表于 2025-3-23 05:49:50
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