嘲笑
发表于 2025-3-23 11:44:06
The Character of Scientific ChangeIn this chapter, chiplet design and heterogeneous integration packaging.
Inferior
发表于 2025-3-23 16:41:35
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synovium
发表于 2025-3-23 19:56:44
https://doi.org/10.1057/9781403982353Cu-Cu hybrid bonding is one of the flip chip assembly technologies.
addict
发表于 2025-3-24 00:06:47
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出没
发表于 2025-3-24 06:06:31
Chiplets Lateral Communications,As mentioned in Chap. ., the key disadvantages of chiplet design and heterogeneous integration packaging are larger packaging size and higher packaging cost.
丰满有漂亮
发表于 2025-3-24 09:35:18
Cu-Cu Hybrid Bonding,Cu-Cu hybrid bonding is one of the flip chip assembly technologies.
削减
发表于 2025-3-24 14:00:22
John H. LauAddresses chiplet design and heterogeneous integraton packaging both in theory and practice.Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs.Writ
独白
发表于 2025-3-24 16:13:36
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裂缝
发表于 2025-3-24 22:05:58
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coddle
发表于 2025-3-24 23:42:25
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