SPIR
发表于 2025-3-21 17:23:03
书目名称Chiplet Design and Heterogeneous Integration Packaging影响因子(影响力)<br> http://impactfactor.cn/2024/if/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging影响因子(影响力)学科排名<br> http://impactfactor.cn/2024/ifr/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging网络公开度<br> http://impactfactor.cn/2024/at/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging网络公开度学科排名<br> http://impactfactor.cn/2024/atr/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging被引频次<br> http://impactfactor.cn/2024/tc/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging被引频次学科排名<br> http://impactfactor.cn/2024/tcr/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging年度引用<br> http://impactfactor.cn/2024/ii/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging年度引用学科排名<br> http://impactfactor.cn/2024/iir/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging读者反馈<br> http://impactfactor.cn/2024/5y/?ISSN=BK0225943<br><br> <br><br>书目名称Chiplet Design and Heterogeneous Integration Packaging读者反馈学科排名<br> http://impactfactor.cn/2024/5yr/?ISSN=BK0225943<br><br> <br><br>
Lumbar-Spine
发表于 2025-3-21 20:39:03
Chiplet Design and Heterogeneous Integration Packaging
aspect
发表于 2025-3-22 00:45:52
http://reply.papertrans.cn/23/2260/225943/225943_3.png
Grating
发表于 2025-3-22 07:13:07
https://doi.org/10.1007/978-981-19-9917-8Chitlet design; Chip partitioning; Chip splitting; Multiple system and heterogenous integration; Chiplet
Radiation
发表于 2025-3-22 09:10:54
http://reply.papertrans.cn/23/2260/225943/225943_5.png
Arbitrary
发表于 2025-3-22 12:57:13
http://reply.papertrans.cn/23/2260/225943/225943_6.png
Arbitrary
发表于 2025-3-22 17:10:22
Scientific Theories and Their Domainsnce, and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-
使厌恶
发表于 2025-3-22 22:16:46
Unity and Method in Contemporary Sciencetegration packaging, as shown in Fig. 3.1, namely, (1) multiple system and heterogeneous integration with thin-film layer directly on top of a build-up package substrate (2.1D IC integration), Fig. 3.1a, (2) multiple system and heterogeneous integration with TSV-less interposer (2.3D IC integration)
冷淡周边
发表于 2025-3-23 03:06:32
http://reply.papertrans.cn/23/2260/225943/225943_9.png
grounded
发表于 2025-3-23 09:19:36
http://reply.papertrans.cn/23/2260/225943/225943_10.png