delusion 发表于 2025-3-26 22:26:39

http://reply.papertrans.cn/23/2245/224500/224500_31.png

招惹 发表于 2025-3-27 04:58:36

Overview of IC Interconnects,ificant component of manufacturing cost (mid 80s). Moreover, since the interconnect performance does not benefit from dimensional scaling as do the transistors in an IC, the interconnects became a performance factor in high speed digital ICs, due to the resistance-capacitance (R-C) delay.

crutch 发表于 2025-3-27 09:05:50

http://reply.papertrans.cn/23/2245/224500/224500_33.png

jaundiced 发表于 2025-3-27 11:38:46

http://reply.papertrans.cn/23/2245/224500/224500_34.png

SLUMP 发表于 2025-3-27 17:11:28

Protektionsverhalten am Point of Saleorporates the fundamentals of pad/abrasive contact into the lubrication and mass transport process. It extends upon the low-κ CMP model developed previously, and may find applicability to dielectrics and other metals with well-known chemical reaction kinetics.

教唆 发表于 2025-3-27 20:45:19

http://reply.papertrans.cn/23/2245/224500/224500_36.png

不怕任性 发表于 2025-3-27 22:37:58

http://reply.papertrans.cn/23/2245/224500/224500_37.png

偏离 发表于 2025-3-28 05:11:52

http://reply.papertrans.cn/23/2245/224500/224500_38.png

包裹 发表于 2025-3-28 07:12:34

Christopher L. Borst,William N. Gill,Ronald J. Gut

Coma704 发表于 2025-3-28 13:30:37

http://reply.papertrans.cn/23/2245/224500/224500_40.png
页: 1 2 3 [4]
查看完整版本: Titlebook: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses; Fundamental Mechanis Christopher L. Borst,Wil