支票 发表于 2025-3-21 19:34:01

书目名称An Introduction to Surface-Micromachining影响因子(影响力)<br>        http://impactfactor.cn/if/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining影响因子(影响力)学科排名<br>        http://impactfactor.cn/ifr/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining网络公开度<br>        http://impactfactor.cn/at/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining网络公开度学科排名<br>        http://impactfactor.cn/atr/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining被引频次<br>        http://impactfactor.cn/tc/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining被引频次学科排名<br>        http://impactfactor.cn/tcr/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining年度引用<br>        http://impactfactor.cn/ii/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining年度引用学科排名<br>        http://impactfactor.cn/iir/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining读者反馈<br>        http://impactfactor.cn/5y/?ISSN=BK0155504<br><br>        <br><br>书目名称An Introduction to Surface-Micromachining读者反馈学科排名<br>        http://impactfactor.cn/5yr/?ISSN=BK0155504<br><br>        <br><br>

scoliosis 发表于 2025-3-21 22:06:51

http://reply.papertrans.cn/16/1556/155504/155504_2.png

CRUE 发表于 2025-3-22 01:34:29

http://reply.papertrans.cn/16/1556/155504/155504_3.png

somnambulism 发表于 2025-3-22 07:52:46

Mechanicsowever, at minimum, a grounding in structural mechanics and beams is necessary. This chapter will provide a brief introduction to the subject. More dedicated readers are referred to Timoshenko and Gere , a standard introduction to mechanics.

gregarious 发表于 2025-3-22 11:37:12

Non-Ideal Processes when deposition occurred. The result of any processing step therefore depends heavily on the preceding steps. Managing topography is an important part of the design process. Generally, design faults relating to topography can be classified into three categories: interference faults, structural faults, and behavioural faults.

雀斑 发表于 2025-3-22 13:14:25

http://reply.papertrans.cn/16/1556/155504/155504_6.png

ILEUM 发表于 2025-3-22 17:24:10

Electro-Thermal-Compliant Actuatorss to flow throughout the device, which cause the temperature to rise due to Joule heating. ETC actuators use the resulting thermal expansion to create motion. Typically, they also have some method of amplifying these small displacements into useable motion.

发表于 2025-3-23 00:30:50

Raised Structurescation. Even a very small chip will be several millimetres on a side. However, the total height of the thin-films will typically be measured in microns. Thus, surface-micromachined devices are quite constrained in this one direction.. This small vertical range can be a disadvantage.

Lethargic 发表于 2025-3-23 03:52:19

http://reply.papertrans.cn/16/1556/155504/155504_9.png

PIZZA 发表于 2025-3-23 08:08:23

Die Zukunft des deutschen Gesundheitswesensmanufacturing processes. They should then build upon this knowledge by learning the basic design techniques used in surface-micromachining. Finally, new designers should learn any specific device knowledge and theory required. Figure 1.1 outlines this hierarchy.
页: [1] 2 3 4 5 6
查看完整版本: Titlebook: An Introduction to Surface-Micromachining; Robert W. Johnstone,M. Parameswaran Book 2004 Springer Science+Business Media New York 2004 LIG