期刊书目 › ENGINEERING, ELECTRICAL & ELECTRONIC(工程，电气和电子) › SCIE期刊IEEE Wireless Communications Letters 2024/2025影响因子:4.699 (IEEE WIREL COMMUN LE) (2162-2337). (ENGINEERING, ELECTR

吞没 发表于 2025-3-26 23:20:09

Submitted on: 30 May 2007.
Revised on: 19 June 2007.
Accepted on: 01 July 2007.

___________________IEEE Wireless Communications Letters

浪荡子 发表于 2025-3-27 01:36:03

Submitted on: 16 September 2013.
Revised on: 16 October 2013.
Accepted on: 03 November 2013.

___________________IEEE Wireless Communications Letters

辞职 发表于 2025-3-27 06:17:20

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Processes 发表于 2025-3-27 11:59:24

Submitted on: 22 May 2010.
Revised on: 13 August 2010.
Accepted on: 28 August 2010.

___________________IEEE Wireless Communications Letters

eardrum 发表于 2025-3-27 15:50:30

Submitted on: 09 November 2011.
Revised on: 19 December 2011.
Accepted on: 05 January 2012.

___________________IEEE Wireless Communications Letters

Resign 发表于 2025-3-27 18:52:02

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