期刊书目 › ENGINEERING, ELECTRICAL & ELECTRONIC(工程，电气和电子) › SCIE期刊IEEE Wireless Communications Letters 2024/2025影响因子:4.699 (IEEE WIREL COMMUN LE) (2162-2337). (ENGINEERING, ELECTR

胶状 发表于 2025-3-25 05:36:21

Submitted on: 01 May 2009.
Revised on: 05 July 2009.
Accepted on: 17 August 2009.

___________________IEEE Wireless Communications Letters

Emmenagogue 发表于 2025-3-25 09:33:36

Submitted on: 24 December 2008.
Revised on: 17 February 2009.
Accepted on: 09 April 2009.

___________________IEEE Wireless Communications Letters

情爱 发表于 2025-3-25 11:44:48

http://reply.papertrans.cn/2/122/12115/12115-23.png

Constrain 发表于 2025-3-25 18:42:59

Submitted on: 02 June 2023.
Revised on: 14 September 2023.
Accepted on: 06 October 2023.

___________________IEEE Wireless Communications Letters

Ambulatory 发表于 2025-3-25 22:50:26

Submitted on: 05 October 2015.
Revised on: 26 December 2015.
Accepted on: 29 January 2016.

___________________IEEE Wireless Communications Letters

睨视 发表于 2025-3-26 03:01:19

http://reply.papertrans.cn/2/122/12115/12115-26.png

invulnerable 发表于 2025-3-26 04:37:26

Submitted on: 10 March 2013.
Revised on: 03 June 2013.
Accepted on: 20 July 2013.

___________________IEEE Wireless Communications Letters

怎样才咆哮 发表于 2025-3-26 11:05:35

Submitted on: 25 June 2016.
Revised on: 16 August 2016.
Accepted on: 28 September 2016.

___________________IEEE Wireless Communications Letters

HEPA-filter 发表于 2025-3-26 13:51:22

Submitted on: 09 December 2002.
Revised on: 20 February 2003.
Accepted on: 11 April 2003.

___________________IEEE Wireless Communications Letters

粉笔 发表于 2025-3-26 18:32:37

http://reply.papertrans.cn/2/122/12115/12115-30.png

查看完整版本: SCIE期刊IEEE Wireless Communications Letters 2024/2025影响因子:4.699 (IEEE WIREL COMMUN LE) (2162-2337). (ENGINEERING, ELECTR