raff淫雨霏霏 发表于 2025-3-21 16:06:30

        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/if/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)影响因子@(材料科学、多学科)学科排名<br>        http://impactfactor.cn/ifr/?ISSN=2156B3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)总引论文<br>        http://impactfactor.cn/at/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)总引论文@(材料科学、多学科)学科排名<br>        http://impactfactor.cn/atr/?ISSN=2156B3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/tc/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)总引频次@(材料科学、多学科)学科排名<br>        http://impactfactor.cn/tcr/?ISSN=2156B3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)即时影响因子<br>        http://impactfactor.cn/ii/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)即时影响因子@(材料科学、多学科)学科排名<br>        http://impactfactor.cn/iir/?ISSN=2156B3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)五年累积影响因子<br>        http://impactfactor.cn/5y/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)五年累积影响因子@(材料科学、多学科)学科排名<br>        http://impactfactor.cn/5yr/?ISSN=2156B3950<br><br>       

精美食品 发表于 2025-3-21 20:18:13

Submitted on: 23 July 2000.
Revised on: 20 September 2000.
Accepted on: 01 October 2000.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

雪崩 发表于 2025-3-22 00:32:57

Submitted on: 27 May 2023.
Revised on: 24 July 2023.
Accepted on: 02 September 2023.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

斗争 发表于 2025-3-22 07:09:23

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简略 发表于 2025-3-22 10:44:26

Submitted on: 16 August 2014.
Revised on: 30 September 2014.
Accepted on: 19 October 2014.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

翻布寻找 发表于 2025-3-22 14:17:40

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RAG 发表于 2025-3-22 18:42:59

Submitted on: 03 November 2022.
Revised on: 15 December 2022.
Accepted on: 05 January 2023.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

葡萄糖 发表于 2025-3-23 01:13:36

Submitted on: 27 September 2006.
Revised on: 10 December 2006.
Accepted on: 21 December 2006.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

滔滔不绝的人 发表于 2025-3-23 05:21:33

Submitted on: 15 November 2008.
Revised on: 13 March 2009.
Accepted on: 27 March 2009.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

仔细阅读 发表于 2025-3-23 08:00:35

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