不透气 发表于 2025-3-25 07:12:25

Submitted on: 06 August 2004.
Revised on: 11 November 2004.
Accepted on: 03 December 2004.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

HAVOC 发表于 2025-3-25 09:27:25

Submitted on: 08 March 2000.
Revised on: 21 May 2000.
Accepted on: 31 May 2000.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

HALL 发表于 2025-3-25 12:13:14

http://reply.papertrans.cn/2/120/11942/11942-23.png

engrossed 发表于 2025-3-25 16:48:53

http://reply.papertrans.cn/2/120/11942/11942-24.png

返老还童 发表于 2025-3-25 23:09:39

Submitted on: 04 December 2009.
Revised on: 08 January 2010.
Accepted on: 03 March 2010.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

一再困扰 发表于 2025-3-26 00:46:30

Submitted on: 08 April 2013.
Revised on: 02 May 2013.
Accepted on: 17 May 2013.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

贪心 发表于 2025-3-26 05:22:43

Submitted on: 27 July 2021.
Revised on: 15 October 2021.
Accepted on: 18 November 2021.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

Onerous 发表于 2025-3-26 11:52:38

Submitted on: 27 December 2021.
Revised on: 06 February 2022.
Accepted on: 04 April 2022.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

得罪 发表于 2025-3-26 16:30:09

Submitted on: 14 February 2025.
Revised on: 19 April 2025.
Accepted on: 25 May 2025.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

有毛就脱毛 发表于 2025-3-26 18:08:29

http://reply.papertrans.cn/2/120/11942/11942-30.png
页: 1 2 [3] 4
查看完整版本: SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影响因子:2.373 (IEEE T COMP PACK MAN)