aspirant
发表于 2025-3-21 20:05:28
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Clinch
发表于 2025-3-21 21:45:40
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因无茶而冷淡
发表于 2025-3-22 02:43:21
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记成蚂蚁
发表于 2025-3-22 07:56:17
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北极人
发表于 2025-3-22 09:49:49
978-981-15-7092-6The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor
rectocele
发表于 2025-3-22 14:36:39
Penglei Ji,Hanchao Li,Luyan Jiang,Xinguo Liu-thin, ultra-light, and high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fab
Urgency
发表于 2025-3-22 18:40:11
Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Li product architects, why it has generated broad industry attention, and why it is seeing increased adoption in recent years (. [.; . [.]; Ingerly et al., IEDM [.]; Elsherbini et al., IEDM .]). The primary focus of this chapter is on 3D architectures that use .hrough .ilicon .ias (TSVs). The key elem
兴奋过度
发表于 2025-3-23 00:17:14
Lecture Notes in Computer Science high aspect ratio trenches in Si, followed by placement of dielectric, barrier and seed layers, TSV filling and polishing, and then assembly with other components of a device. In addition, planarization, die-thinning and flow processes to fabricate TSV-enabled 3-D architectured microelectronic pack
misshapen
发表于 2025-3-23 04:58:36
Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Lie reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite-element based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation o
Delectable
发表于 2025-3-23 08:42:03
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