军械
发表于 2025-3-21 18:47:06
书目名称3D Interconnect Architectures for Heterogeneous Technologies影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0100739<br><br> <br><br>书目名称3D Interconnect Architectures for Heterogeneous Technologies读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0100739<br><br> <br><br>
调情
发表于 2025-3-21 20:56:02
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古董
发表于 2025-3-22 03:27:00
,Merkmale der Ökonomisierung von Bildung,systems cannot fulfill these requirements. Networks on chips meet the demands above as the number of routers can easily be adjusted to the number of processing elements. In addition, it mitigates the global-wire delay problem.
窝转脊椎动物
发表于 2025-3-22 08:07:00
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汇总
发表于 2025-3-22 11:31:36
,Die Öffentlichkeit der Soziologie,ires. The method takes the edge effects into account, which enables a much higher improvement in the TSV performance than previous techniques and, for the first time, in a simultaneous improvement in the 3D-interconnect power consumption.
narcotic
发表于 2025-3-22 15:36:45
https://doi.org/10.1007/978-3-658-09449-2cases where the large through-silicon via (TSV) dimensions or their low manufacturing yield are serious design concerns. Additionally, the technique is only applicable if the signal edges on the interconnects are perfectly temporal aligned.
助记
发表于 2025-3-22 17:04:01
Durchbruch: Mystik, Kybernetik und Beatkult,(ICs) (i.e., that routers are globally asynchronous). This chapter will extend the previous findings by considering this challenge and derive specific routing algorithms for heterogeneous 3D NoCs. The routing algorithms will also require co-designed router architectures.
小鹿
发表于 2025-3-22 23:19:56
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BROTH
发表于 2025-3-23 05:04:19
Book 2022ook provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs..
Infiltrate
发表于 2025-3-23 08:07:36
alistin.Includes supplementary material: .Biofeedback zeigt, wie der Körper auf verschiedene Situationen des täglichen Lebens, wie etwa Stress, Angst oder Freude durch Veränderung der Herzrate, Atmung, Muskelspannung, Fingertemperatur, Hautleitwert, reagiert. Es fördert die Selbstwahrnehmung und erm