Definitive
发表于 2025-3-28 17:05:07
Conference proceedings 2008design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues.
终止
发表于 2025-3-28 20:54:44
VLSI-SoC: Research Trends in VLSI and Systems on ChipFourteenth Internati
deficiency
发表于 2025-3-29 02:13:58
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ambivalence
发表于 2025-3-29 06:58:41
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FATAL
发表于 2025-3-29 10:23:13
Innovative Optoeletronic Approaches to Biomolecular Analysis with Arrays of Silicon Devices,s a new approach for the development of integrated molecular analysis. The technique presented hereafter combine a labelfree method for molecular characterization based on UV absorbance and two technologies of silicon photodetectors addressed to fulfill the requirements of different applications.
PHAG
发表于 2025-3-29 14:24:21
Electronic Detection of DNA Adsorption and Hybridization,or arrays is achieved by deposition with a microspotting device or specific hybridization between complementary oligonucleotide sequences. The current voltage characteristics of the transistors are measured with the sample surface immersed in aqueous solution. The chapter provides a brief overview o
DEAWL
发表于 2025-3-29 17:59:07
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分离
发表于 2025-3-29 21:39:23
A CMOS Mixed-Mode Sample-and-Hold Circuit for Pipelined ADCs,t consists of a switched-capacitor (SC) amplifier and a comparator to generate the mixed-mode sampled output data, which are represented both in analog and digital forms. The mixed-mode sampling technique reduces the operational amplifier (op amp) output swing. As a result, the requirements on op am
faculty
发表于 2025-3-30 03:16:44
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ALERT
发表于 2025-3-30 05:26:39
Reliability Issues in Deep Deep Submicron Technologies: Time-Dependent Variability and its Impact oerformance, without requiring significant additional design effort. Scaling past the 45 nm technology node, however, brings a number of problems whose impact on system level design has not been evaluated yet. Random intra-die process variability, reliability degradation mechanisms and their combined