健谈 发表于 2025-3-28 15:01:14

Electromigration Analysis of VLSI Circuits Using the Finite Element Method,ite element method (FEM), are increasingly overwhelmed by the complexity of the task. With further technology scaling, it is predicted that FEM will not be usable anymore for a full-chip EM analysis due to complexity reasons. To address this bottleneck, we present a new methodology enabling an FEM-b

我正派 发表于 2025-3-28 19:02:44

On the Efficiency of Early Bird Sampling (EBS) an Error Detection-Correction Scheme for Data-Drivenprovide continuous feedback about the health of the circuit. The key components of a EDC architecture are embedded timing sensors that check the compliance of timing constraints at run-time and drives the computation to safely evolve toward the minimum energy point..While most of the existing EDC so

jagged 发表于 2025-3-28 23:13:42

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食品室 发表于 2025-3-29 06:39:43

Modeling and Evaluation of Application-Aware Dynamic Thermal Control in HPC Nodes,xaflops era. Energy and temperature walls are big challenges to face for assuring a constant grow of performance in future. New generation architectures for HPC systems implement HW and SW components to address energy and thermal issues for increasing power and efficient computing in scientific work

CRP743 发表于 2025-3-29 11:07:40

Pushing the Limits Further: Sub-Atomic AES,gs, has created a great demand for compact, lightweight and cheap to produce implementations of cryptographic primitives..One approach to meet this demand is the development and standardisation of new tailored primitives, most prominently PRESENT. Yet, the wide proliferation of the Advanced Encrypti

CHANT 发表于 2025-3-29 13:23:48

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tangle 发表于 2025-3-29 15:59:53

Conference proceedings 2019le Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. .The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. The
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查看完整版本: Titlebook: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things; 25th IFIP WG 10.5/IE Michail Maniatakos,Ibrahim (Abe) M. Elfadel,Rica