podiatrist
发表于 2025-3-26 21:54:45
978-3-642-08272-6Springer-Verlag Berlin Heidelberg 1998
arrogant
发表于 2025-3-27 02:14:38
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placebo-effect
发表于 2025-3-27 07:43:40
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growth-factor
发表于 2025-3-27 09:36:13
Particle Adhesion and Removal on Wafer Surfaces in RCA Cleaning) and the electrostatic force (the reciprocal action of an electrical double layer). Research related to the particle adhesion mechanism on wafer surfaces in solutions that conform to the above two actions has thrived in recent years, and has done much to clarify the particle adhesion mechanism .
敏捷
发表于 2025-3-27 15:15:11
Effects of Electrostatic Charge on Particle Adhesion on Wafer Surfacesthe deposition of airborne particles due to static electricity, device defects due to static discharge, electron beam exposure time, etc., constitute electron orbit damage. These types of electrostatic damage have manifested themselves at extremely high rates accompanying the higher integration of circuitry.
可商量
发表于 2025-3-27 18:05:13
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lipids
发表于 2025-3-27 23:31:39
https://doi.org/10.1007/978-3-662-03535-1Technologie; VLSI; production; quality; semiconductor devices
mortgage
发表于 2025-3-28 04:46:02
Particle Deposition in VacuumThe relationship between particles and wafers in a vacuum can be divided into the following three categories, which will be discussed along with countermeasures against particles:
Cryptic
发表于 2025-3-28 09:15:08
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GROG
发表于 2025-3-28 10:30:35
Influence of Metallic Contamination on Dielectric Degradation of MOS Structuresever, by using several kinds of intentional contamination experiments, it has been made clear that the mechanisms of dielectric degradation are generally classified into the five categories discussed in Sects. 4.1.1–4.1.5.