外面 发表于 2025-3-28 16:26:16
Jeffrey Yi-Lin Forrest,Davood Darvishi,Abdou K. Jallow,Zhen Liok, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed..978-1-4419-2284-7978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812Vertebra 发表于 2025-3-28 21:41:40
Jeffrey Yi-Lin Forrest,Kurt Schimmel,Fen Wang,Ashkan Hafezalkotob,Jian Liuok, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed..978-1-4419-2284-7978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812善变 发表于 2025-3-28 22:57:31
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unting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics繁忙 发表于 2025-3-29 07:59:03
Jeffrey Yi-Lin Forrest,Davood Darvishi,Rhonda S. Clark,Mojtaba Seyedian,Jun Liu,Lawrence Shao,Shynarsurface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics 978-94-011-6052-0978-94-011-6050-6Genteel 发表于 2025-3-29 15:27:57
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http://reply.papertrans.cn/89/8848/884735/884735_47.pngFresco 发表于 2025-3-29 21:02:26
electromigration.Emphasizes reliability issues related to so.Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1.st., 2006. There is an urgent need for an increase in the research and developmFrequency-Range 发表于 2025-3-30 02:59:37
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