patch-test
发表于 2025-3-21 16:21:05
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卧虎藏龙
发表于 2025-3-21 23:10:08
Introduction to Surface Mount Technologys used to mount electronic components on the surface of printed circuit boards or substrates. Conventional technology, by contrast, inserts components through holes in the board. This deceptively simple difference changes virtually every aspect of electronics: design, materials, processes, and assembly of component packages and substrates.
可能性
发表于 2025-3-22 00:26:11
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使害羞
发表于 2025-3-22 05:28:47
Surface Mount Design Considerations performance-driven products do not have to be cost effective. It means only that performance is the overriding issue. The designer must also ensure that the product will meet thermal and reliability requirements and can be designed and built in a timely manner to succeed in a given market window.
使混合
发表于 2025-3-22 09:51:48
Metallurgy of Soldering and Solderabilityhe role of the surface mount solder joint has become very critical, because it must provide both mechanical and electrical connections. The solder joint strength is controlled by the land pattern design and a good metallurgical bond between component and board.
杀死
发表于 2025-3-22 13:09:18
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municipality
发表于 2025-3-22 18:00:33
Flux and Cleaningc impurities from the soldering surfaces and prepare a clean surface for joining. After soldering, the flux residues or contaminants must be removed by cleaning. The type of contaminant is determined primarily by the type of flux used, but halides, oxides, and various other contaminants are introduced during storage and handling, as well.
激怒
发表于 2025-3-23 01:05:08
Surface Mount Land Pattern Designtern design. However, the producibility of SMA is not determined by pad design alone. Materials, processes, components, and board solderability also play very important roles. These issues are covered elsewhere in this book.
Ataxia
发表于 2025-3-23 03:17:13
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说笑
发表于 2025-3-23 08:52:46
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