先驱
发表于 2025-3-30 11:47:44
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DALLY
发表于 2025-3-30 15:19:00
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Clumsy
发表于 2025-3-30 20:14:50
Reliability and Lifetime Assessment of Optical Materials in LED-Based Products,ents within the system, including the chip, the driver, and the optical materials (i.e., phosphorous layer). The kinetics of degradation in real-life applications is relatively slow, and in most cases, it takes several years to see an obvious deterioration of optical properties. A highly accelerated
陶醉
发表于 2025-3-31 00:30:13
The Influence of Phosphor and Binder Chemistry on the Aging Characteristics of Remote Phosphor Prodgh-temperature operational lifetime testing (WHTOL). As part of the experimental matrix, two different correlated color temperature (CCT) values, 2,700 K and 5,000 K, were studied and each had a different binder chemistry. The 2,700 K samples used a urethane binder, whereas the 5,000 K samples used
受辱
发表于 2025-3-31 01:53:08
Thermal Characterization of Die-Attach Material Interface of High-Power Light-Emitting Diodes,attach thermal interface (DTI) in high-power light-emitting diodes (LEDs). After describing the unique transient behavior of high-power LEDs associated with the forward voltage method, a hybrid analytical/numerical model is utilized to determine an approximate transient junction temperature behavior
柱廊
发表于 2025-3-31 06:11:42
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construct
发表于 2025-3-31 10:45:01
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parsimony
发表于 2025-3-31 16:55:50
Chromaticity Maintenance in LED Devices,nding the long-term performance of LEDs. Specifically, there is a need to understand and predict the ability of LEDs to maintain luminous flux and chromaticity over time. The issue of chromaticity maintenance (aka, chromaticity stability and color shift) is especially important for LED devices since
过滤
发表于 2025-3-31 17:46:02
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nitroglycerin
发表于 2025-4-1 01:16:16
Advances in LED Solder Joint Reliability Testing and Prediction, way becomes a cutting edge of the industry, which can greatly diminish the design cycle and hence reduce the time to market. This chapter introduces two methodologies of doing fast reliability qualification of solder joint in LED assemblies: FEM-assisted lifetime estimation modeling and in situ hig