鸣叫大步走
发表于 2025-3-21 16:12:22
书目名称Solder Paste in Electronics Packaging影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0871496<br><br> <br><br>书目名称Solder Paste in Electronics Packaging读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0871496<br><br> <br><br>
后退
发表于 2025-3-21 22:42:35
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男生戴手铐
发表于 2025-3-22 03:52:48
Soldering Methodologies technology it means to flow or melt the paste, rather than to re-flow. Since it has been an accepted term in the solder paste field, „reflow“ will be used in this text. The reflow methods discussed here do not deal with wave soldering or other soldering techniques unrelated to the paste form.
证明无罪
发表于 2025-3-22 07:10:05
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OASIS
发表于 2025-3-22 11:29:56
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迎合
发表于 2025-3-22 14:25:22
Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problemsis chapter is to condense the common concerns and problems encountered by using solder paste one by one into a check list. It is hoped this chapter can be used as a troubleshooting guide with the objective that the users be able to establish a „trouble-free“ process by intelligently learning from others’ experiences.
先驱
发表于 2025-3-22 18:13:24
978-94-011-6052-0Van Nostrand Reinhold 1989
CLAM
发表于 2025-3-22 21:16:17
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Irremediable
发表于 2025-3-23 05:04:28
https://doi.org/10.1007/978-94-011-6050-6assembly; coating; electronics; laser; manufacturing; metals; packaging
形容词
发表于 2025-3-23 06:54:51
Interdisciplinary ApproachSolder paste is simple and plain in appearance, yet its fundamentals are broad and complex. It can be well understood only with an interdisciplinary approach.