新字
发表于 2025-3-23 12:23:30
Routing in SoC Physical Design, This chapter deals with interconnecting signals, routing algorithms, and optimization techniques in SoC design. The chapter covers routing challenges of SoC design and ways to address them.
皮萨
发表于 2025-3-23 16:17:15
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ARY
发表于 2025-3-23 19:16:26
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箴言
发表于 2025-3-24 00:35:21
Advanced Packages and 3D-SoC Designs,This chapter introduces SoC packages, evolution and recent trends in package designs. The chapter also describes the EDA tool features for packaging. It introduces the concept of 3D IC design which is most promising design technique.
骇人
发表于 2025-3-24 05:24:35
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MINT
发表于 2025-3-24 08:31:39
Question Bank,This chapter lists a set of questions selected chapter-wise for readers to test their understanding. Answers are also given at the end of the chapter.
Flatter
发表于 2025-3-24 14:27:49
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SLING
发表于 2025-3-24 15:03:26
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马笼头
发表于 2025-3-24 20:51:43
https://doi.org/10.1007/978-3-030-98112-9SOC Design; VLSI Physical Design; Clock Tree Synthesis; Standard Cell Library; Tape Out; Unified Power Fo
夸张
发表于 2025-3-25 02:13:24
Floor Plan and Placement of SoC Design,sical design tools. Few design decisions for achieving good placement are discussed in this chapter.The physical design flow described in this chapter is mostly applicable to automatic cell based SoC design.