Lampoon
发表于 2025-3-21 16:09:47
书目名称Simulation by Bondgraphs影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0867592<br><br> <br><br>书目名称Simulation by Bondgraphs读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0867592<br><br> <br><br>
游行
发表于 2025-3-21 22:46:37
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GUILE
发表于 2025-3-22 00:34:12
Simulation and Graphical System Models,pose is to get a quantitative understanding of their operation, improve their performance by variation of parameters and to find possible critical points before the actual system is built at a high expense. ..
arrogant
发表于 2025-3-22 05:20:14
Simulation and Design of Mechanical Engineering Systems, Now we are at a point where the way splits into the art of writing Bondgraphs (upper path) and into computation from Bondgraphs (lower path). Later they will approach each other again and become the Bondgraph way of life.
MILL
发表于 2025-3-22 11:57:55
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SIT
发表于 2025-3-22 13:28:07
Electric Circuits, Drives and Components,n sec. 5.3 we shall examine the interaction of electric and magnetic fields with mechanical members in more detail. In this section we shall neglect parasitic effects of resistors, capacitors and inductors and treat them as R-, C- and I-elements. Thus, we neglect effects like inductivity of a resist
obsession
发表于 2025-3-22 19:57:26
Computational Overview, Practical Procedures and Problems,the other program. In essence, a fully augmented Bondgraph (with all power directions and causalities) is equivalent to a set of equations that can be programed directly in language like BASIC, PASCAL, FORTRAN or C.
词汇记忆方法
发表于 2025-3-23 00:05:17
Applications to Thermodynamics, Chemistry and Biology,le 2.1) and entropy itself is accumulated entropy flow (Thoma 1970B). Hence the fundamental point to know is that thermal power in conduction, usually called heat flux, is absolute temperature times entropy flow. This fundamental equation appears in Fig. 7.1. Some important observations:
亵渎
发表于 2025-3-23 03:35:28
Selected Questions, of simple bonds that are somehow related. An example would be the movement of a robot hand in three dimensional space with speeds in the x, y and z directions. We can also think about the transformation into other coordinates, say polar coordinates, and this establishes the connection to mechanisms
悄悄移动
发表于 2025-3-23 07:25:50
Electric Circuits, Drives and Components,arasitic effects of resistors, capacitors and inductors and treat them as R-, C- and I-elements. Thus, we neglect effects like inductivity of a resistance, leakage of a capacitor and winding capacity of an inductor. Such effects can always be added from the known electronic equivalent circuits once the systematic writing of Bondgraphs is familiar.