初生
发表于 2025-3-21 17:59:58
书目名称Silicon Photonics III影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0867329<br><br> <br><br>书目名称Silicon Photonics III读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0867329<br><br> <br><br>
judicial
发表于 2025-3-21 22:13:30
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Limerick
发表于 2025-3-22 02:13:35
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Acupressure
发表于 2025-3-22 08:20:08
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轻打
发表于 2025-3-22 11:24:55
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锡箔纸
发表于 2025-3-22 14:58:31
Athermal Silicon Photonics,tuning and TO switching. The TO effect, however, becomes a significant burden in wavelength-filtering devices such as ring resonators and arrayed waveguide gratings (AWG) which need stable operation independent of ambient temperature. Precise temperature control is usually necessary for the stable f
挖掘
发表于 2025-3-22 19:29:32
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溺爱
发表于 2025-3-22 23:37:54
,Hardware–Software Integrated Silicon Photonics for Computing Systems,or high-performance computer systems that need to distribute extremely large amounts of data in an energy-efficient manner. Chip-scale optical interconnects that employ novel silicon photonics devices can potentially leapfrog the performance of traditional electronic-interconnected systems. However,
损坏
发表于 2025-3-23 02:43:28
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Palliation
发表于 2025-3-23 06:49:45
Packaging of Silicon Photonic Devices,ms, datacoms and sensing applications. Device fabrication based on CMOS wafer-scale processes can meet this demand. However, photonic packaging can be a device-by-device process which is difficult to scale to high volumes. Packaging challenges remain in areas such as fiber-array coupling, laser sour