草率女 发表于 2025-3-26 23:55:58
http://reply.papertrans.cn/83/8283/828201/828201_31.pngconvulsion 发表于 2025-3-27 02:49:43
Inversion of Residual Stresses in Silicon Wafer from Surface Deflection Measurements, obtained by the propose method are compared. Also from actual deflection distribution of silicon wafers, Residual stresses are estimated by the proposed method. Results show that the residual stress in silicon wafers can be obtained by the proposed method.Prologue 发表于 2025-3-27 06:02:31
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Identification of Constitutive Parameters from Full Thermal and Kinematic Fields: Application to Hyntification of hyperelastic parameters from a heterogeneous heat source field. Due to large deformation undergone by the rubber specimen tested, a motion compensation technique is developed to plot the kinematic and thermal fields at the same points before reconstructing the heat source.红肿 发表于 2025-3-27 15:11:08
http://reply.papertrans.cn/83/8283/828201/828201_35.pngSputum 发表于 2025-3-27 20:12:08
http://reply.papertrans.cn/83/8283/828201/828201_36.pnggustation 发表于 2025-3-28 01:28:02
http://reply.papertrans.cn/83/8283/828201/828201_37.png纬线 发表于 2025-3-28 05:36:42
http://reply.papertrans.cn/83/8283/828201/828201_38.pngCRP743 发表于 2025-3-28 09:38:22
Calorific Analysis of a Granular System Made in Shape Memory Alloy, thermography. Production and absorption of latent heat were observed in the contact zones between cylinders. Results enable us to envisage the circulation of a fluid through the SMA granular material for heat transfer.湿润 发表于 2025-3-28 11:18:48
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