小歌剧 发表于 2025-3-28 16:59:57
http://reply.papertrans.cn/83/8235/823436/823436_41.pngContracture 发表于 2025-3-28 19:44:16
A Study of Electrodeposited Gold Thin Films Using a Confocal Laser Scanning Microscope,ace roughness of the gold deposited specimens by both the processes are compared by analyzing them using CLM. Experiments are done for a suitable choice of the PC and PRC parameters to enable gold to electrodeposit with the least surface roughness.反馈 发表于 2025-3-29 00:19:14
http://reply.papertrans.cn/83/8235/823436/823436_43.pngobservatory 发表于 2025-3-29 04:52:15
Trisodium 2-Hydroxypropane-1,2,3-Tricarboxylate Encapsulated Nanocontainer-Based Template-Free Elecectron microscopy (TEM). This electrochemical approach of synthesis shows excellent stability in the synthesized NPs compared with chemical reduction method. These synthesized Cu/Cu.O/CuO nanoparticles were studied for antimicrobial activities against E.., ., and .. The range of minimum inhibitory cSTEER 发表于 2025-3-29 08:16:16
http://reply.papertrans.cn/83/8235/823436/823436_45.pngGRUEL 发表于 2025-3-29 11:24:03
Dielectric Properties of Ni,Cu,Fe,O,:PbZr,Ti,O, Multilayered Nanocomposites,hed between ferrite layers. The dielectric properties of these multilayered thick films have been studied at room temperature in the frequency range from 100 Hz to 1 MHz. The dielectric constant decreases with an increase in frequency exhibiting normal dielectric behavior. Dispersion is observed at灌输 发表于 2025-3-29 17:20:47
http://reply.papertrans.cn/83/8235/823436/823436_47.pngentreat 发表于 2025-3-29 21:07:04
http://reply.papertrans.cn/83/8235/823436/823436_48.pngcognizant 发表于 2025-3-30 03:20:02
http://reply.papertrans.cn/83/8235/823436/823436_49.pngSchlemms-Canal 发表于 2025-3-30 07:16:40
Vinay Gangaraju,Kunal Roy,Mahesh Shastri,Navya Rani Marilingaiah,Manjunath Shetty,Hiroaki Kobayashi,of EE and X-ray photoelectron spectroscopy (XPS); IV. EE and XPS characteristics of practical surfaces. In the last part, the EE and XPS results for metals, semiconductors, and carbon material978-981-19-6950-8978-981-19-6948-5Series ISSN 0931-5195 Series E-ISSN 2198-4743