SEVER 发表于 2025-3-26 22:13:25

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PALL 发表于 2025-3-27 02:27:59

he superconducting gap is estimated to be 2⊿/k.T. = 4.5, indicating that the superconductivity in Y.C. can be described by s-wave strong coupling regime. From specific heat in various magnetic fields, the upper critical field H.(0) is estimated to be 24.7 T.

HUSH 发表于 2025-3-27 06:38:18

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fabricate 发表于 2025-3-27 12:04:16

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食物 发表于 2025-3-27 15:56:38

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反复无常 发表于 2025-3-27 18:08:29

https://doi.org/10.1007/978-1-4419-0984-83D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; h

shrill 发表于 2025-3-28 00:53:29

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Flavouring 发表于 2025-3-28 04:16:01

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碳水化合物 发表于 2025-3-28 07:34:37

LTCC Substrates for RF/MW Application,h performance up to millimeter-wave region. In our chapter, we will review LTCC fabrication processes, characteristics all of main commercially available LTCC material systems and LTCC current status and trend.

FADE 发表于 2025-3-28 14:08:08

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查看完整版本: Titlebook: RF and Microwave Microelectronics Packaging; Ken Kuang,Franklin Kim,Sean S. Cahill Book 2010 Springer-Verlag US 2010 3D packaging.RF and m