TIBIA
发表于 2025-3-21 19:50:11
书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0780770<br><br> <br><br>书目名称Quantifying and Exploring the Gap Between FPGAs and ASICs读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0780770<br><br> <br><br>
中和
发表于 2025-3-21 23:03:13
http://reply.papertrans.cn/79/7808/780770/780770_2.png
Adj异类的
发表于 2025-3-22 00:42:38
https://doi.org/10.1007/978-1-4419-0739-4ASIC; Application Specific Integrated Circuit; CAD Flow; FPGA; Field Programmable Gate Arrays; Gate Array
香料
发表于 2025-3-22 06:10:07
http://reply.papertrans.cn/79/7808/780770/780770_4.png
包裹
发表于 2025-3-22 10:50:22
Book 2010art integrated circuit process technology, and in doing so, democratize this technology of our time. This book is about comparing the qualities of FPGA – their speed performance, area and power consumption, against custom-fabricated ICs, and exploring ways of mitigating their de ciencies. This work
芦笋
发表于 2025-3-22 15:15:38
http://reply.papertrans.cn/79/7808/780770/780770_6.png
虚度
发表于 2025-3-22 18:33:26
http://reply.papertrans.cn/79/7808/780770/780770_7.png
glowing
发表于 2025-3-22 21:47:15
Conclusions and FutureWork,nities to trade off area and delay through varied transistor-level and architectural trade-offs. Such trade-offs allow the gap to be navigated by improving one attribute at the expense of another. The knowledge we have gained is summarized in the following section.
止痛药
发表于 2025-3-23 01:41:48
Introduction,e to market than more customized approaches such as full-custom VLSI or application-specific integrated circuit (ASIC) design. This provides digital circuit designers with access to many of the benefits of the latest process technologies without the expense and effort that accompany these technologies when custom design is used.
范例
发表于 2025-3-23 06:15:53
Measuring the Gap,o aim to narrow the gap, and system designers, who select implementation media based on their knowledge of the gap. As well, this measurement of the gap motivates the latter half of the work in this book which explores the trade-offs that can be made to selectively narrow one dimension of the gap at the expense of another.