goodwill
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cartilage
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Isidoro Di Carlo,Adriana Toroel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
骂人有污点
发表于 2025-3-28 22:57:48
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ensemble
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Paolo Limongelli,Andrea Belli,Luigi Cioffi,Gianluca Russo,Alberto D’Agostino,Corrado Fantini,Giulio nd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta
Picks-Disease
发表于 2025-3-29 08:11:46
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Fecundity
发表于 2025-3-29 13:20:29
Takuya Hashimoto,Norihiro Kokudo,Masatoshi Makuuchiel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
护航舰
发表于 2025-3-29 19:00:56
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Ptsd429
发表于 2025-3-29 20:50:51
Helge Bruns,Jürgen Weitz,Michael Kremer,Markus W. Büchler,Peter Schemmernd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta
tattle
发表于 2025-3-30 00:47:39
Palepu Jagannath,Deepak Chhabra,Rajiv Shahel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
Encapsulate
发表于 2025-3-30 05:45:18
Matteo Donadon,Guido Torzilliel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency