Spinal-Tap
发表于 2025-3-25 04:52:54
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狂热语言
发表于 2025-3-25 11:35:04
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peritonitis
发表于 2025-3-25 15:16:07
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Anguish
发表于 2025-3-25 15:59:41
0893-3405 ection for Integrated Circuits: An IC Design Perspective. provides both fundamental and advanced materials needed by a circuit designer for designing ESD protection circuits, including: ..Testing models and standards adopted by U.S. Department of Defense, EIA/JEDEC, ESD Association, Automotive Elect
冰雹
发表于 2025-3-25 23:51:57
Advanced ESD Protection,ons in ESD protection circuit design. The ESD-circuit interaction becomes an inevitable and critical issue in chip-level ESD protection design. The ESD-to-circuit influence must be considered in chip designs. Circuit malfunction due to possible accidental triggering of ESD protection structures caus
ABIDE
发表于 2025-3-26 02:21:29
ESD Failure Analysis and Modeling, understand ESD protection failure mechanisms and to avoid making similar design mistakes repeatedly. Typical ESD failure signatures, such as, silicon filament, metal interconnect burnout, contact spiking, gate oxide rupture, etc, are discussed. Case examples are given to show how FA analysis techni
样式
发表于 2025-3-26 06:03:08
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Watemelon
发表于 2025-3-26 08:53:53
ESD-circuit Interactions,re itself. A working stand-alone ESD protection structure does not guarantee a functional IC chip. There exist strong ESD-circuit interactions. On one hand, the core circuit may affect the performance of ESD protection significantly, resulting in pre-mature ESD failures due to parasitic internal dis
folliculitis
发表于 2025-3-26 13:57:50
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CROAK
发表于 2025-3-26 20:36:10
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