Arthropathy 发表于 2025-3-26 21:01:59

http://reply.papertrans.cn/67/6690/668944/668944_31.png

irreparable 发表于 2025-3-27 03:18:49

Contaminant Transport in Partially Saturated Porous Media,Our numerical solution is based on an implicit time and space discretization. The convergence of our numerical solution to the weak solution of the original problem is discussed. Finally, we demonstrate in our numerical experiments and comparisons with the benchmark solution (in 1D) the effectiveness of our method.

PTCA635 发表于 2025-3-27 07:41:16

http://reply.papertrans.cn/67/6690/668944/668944_33.png

impale 发表于 2025-3-27 12:11:18

http://reply.papertrans.cn/67/6690/668944/668944_34.png

恶意 发表于 2025-3-27 16:52:39

http://reply.papertrans.cn/67/6690/668944/668944_35.png

培养 发表于 2025-3-27 19:30:53

Alexander Tarasenko,Lubomir Jastrabíkis technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space

相信 发表于 2025-3-27 23:50:37

http://reply.papertrans.cn/67/6690/668944/668944_37.png

腐烂 发表于 2025-3-28 03:58:14

Felipe Ferreira Luz,Sandro Campos Amico,Jeferson Ávila Souza,Enivaldo Santos Barbosa,Antonio Gilson is technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space

Emasculate 发表于 2025-3-28 08:20:55

http://reply.papertrans.cn/67/6690/668944/668944_39.png

嬉耍 发表于 2025-3-28 14:18:19

P. Kumar,F. Topin,M. Miscevic,P. Lavieille,L. Tadristis technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space
页: 1 2 3 [4] 5
查看完整版本: Titlebook: Numerical Analysis of Heat and Mass Transfer in Porous Media; J.M.P.Q. Delgado,Antonio Gilson Barbosa Lima,Marta Book 2012 Springer-Verlag