步兵 发表于 2025-3-30 10:46:37
http://reply.papertrans.cn/67/6669/666826/666826_51.png不理会 发表于 2025-3-30 13:10:19
http://reply.papertrans.cn/67/6669/666826/666826_52.pngadulterant 发表于 2025-3-30 18:42:17
http://reply.papertrans.cn/67/6669/666826/666826_53.png贪心 发表于 2025-3-30 22:55:03
Qinyuan Liao,Dongyang Jiang,Shuai Zhang,Xiaoyan Qiuvided, together with a discussion of the correlation between IC-level and system-level ESD testing methods. The IC-level ESD protection design is demonstrated with representative case studies which are analyzed with various numerical simulations and ESD testing. The overall methodology for IC-systemEntirety 发表于 2025-3-31 03:51:15
http://reply.papertrans.cn/67/6669/666826/666826_55.pngFabric 发表于 2025-3-31 05:48:04
Jingshu Tang,Erya Gao,Xinmei Huang,Yang Liu,Wenwei Shaotion issues. Finally, the third part of the book presents reconfigurable SoCs from the perspective of the designer, through three indicative case studies from the wireless and multimedia communication domain..978-1-4419-3864-0978-0-387-26104-1