强烈的愿望 发表于 2025-3-21 17:01:46
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Thermal Noise, also emerged as a major design concern for high-performance integrated circuits for the future technology nodes as it significantly affects the performance of a chip. The increased temperature affects both interconnect resistance and driving strength of buffers. Since the driving strengths of the cParallel 发表于 2025-3-23 01:03:41
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