上釉彩
发表于 2025-3-25 03:54:32
Hard Nanocomposite Films Prepared by Reactive Magnetron Sputteringtwo fundamental questions: (1) The enhanced hardness of the sputtered film is due to its high intrinsic macrostress σ, induced by the ion bombardment used in their formation, or to its nanostructure? and (2) What is the origin of the hardness in single-phase films? The second part of the paper repor
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发表于 2025-3-25 09:17:59
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Genteel
发表于 2025-3-25 13:29:11
Hybrid Plasma Deposition Methods for Synthesis of Nanostructured Materialsed coatings, including WC/DLC, WC/DLC/WS., YSZ/Au, and YSZ/Au/MoS./DLC nano-composites for wear protection of engineering components. Recently we initiated exploration of a new hybrid process, using filtered vacuum arc and magnetron sputtering, as an aletranative to MSPLD. Initial studies were perfo
混沌
发表于 2025-3-25 18:54:36
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暂时中止
发表于 2025-3-25 21:58:44
Multicomponent Nanostructured Thin Films. Deposition, Characterization, Testing and Applicationand chemical composition of the films were studied by means of Auger electron spectroscopy (AES), energy-dispersive X-ray spectroscopy (EDXS), X-ray diffraction (XRD), scanning and transmission electron microscopy (SEM and TEM), high-resolution (HR) TEM, X-ray photoelectron spectroscopy (XPS), and e
Verify
发表于 2025-3-26 04:04:07
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Triglyceride
发表于 2025-3-26 07:28:29
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博爱家
发表于 2025-3-26 10:13:15
R.D. Arnell,P.J. Kelly,J.W. Bradleyvering all significant publications to the present day. The content is kept as simple as possible to help those new to the field. At the same time, the deep insights into theoretical and technical aspects will support even the most advanced specialists in their everyday practice. .978-3-030-09976-3978-3-319-70638-2
circumvent
发表于 2025-3-26 15:12:29
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中世纪
发表于 2025-3-26 18:41:46
Z. Werner,W. Szymczyk,J. Piekoszewskiystem that served to integrate astronomy and natural philosophy, precisely the aim of the “New Science” of the 17th century. As such, it becomes a fundamentally important historical question to determi978-3-030-10779-6Series ISSN 1385-0180 Series E-ISSN 2215-0064