DEMN
发表于 2025-3-26 22:06:55
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Fester
发表于 2025-3-27 02:56:36
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薄荷醇
发表于 2025-3-27 07:52:46
Introduction,edicted. This is achieved through product verification at each stage. ICs go through two main verification processes: 1) design verification and 2) manufacturing test. The goal of manufacturing test is to verify that the ICs were manufactured correctly, assuming that the design was correct. Due to t
易于交谈
发表于 2025-3-27 10:00:07
At-speed Test Challenges for Nanometer Technology Designs, forgotten. But ICs built at 90 nanometers and below pose new and com-plex challenges for design-for-testability (DFT) tools and techniques. At those geometries, small delay defects become a major contributor to chip failures, but they can‘t be detected by conventional automatic test pattern generat
Oafishness
发表于 2025-3-27 14:26:22
Local At-Speed Scan Enable Generation Using Low-Cost Testers,sed test methodology, it is common to use transition delay fault model for at-speed testing. The test procedure is to create a transition at a node using scan chains for controllability, capture the results after a time period equal to one system clock cycle, and observe the contents of the scan cha
conceal
发表于 2025-3-27 18:26:16
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组成
发表于 2025-3-28 00:58:19
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粉笔
发表于 2025-3-28 02:10:01
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integrated
发表于 2025-3-28 09:27:26
Screening Small Delay Defects,ts. Resistive open and short are two such defects that cause timing or logic failures in the design. Such defects can cause gross or small delay defects depending on the size of their resistance. It is proven that the population of such defects increases as technology scales, thus increasing small d
杀人
发表于 2025-3-28 13:11:43
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