MASS
发表于 2025-3-21 20:02:56
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预感
发表于 2025-3-21 22:12:47
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Factorable
发表于 2025-3-22 01:59:33
SRAM and e-DRAM.Describes 3D integration of integrated circ.This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail wha
不能和解
发表于 2025-3-22 07:37:57
Book 2015 gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore‘s Law”. Coverage focuses on three key
GIDDY
发表于 2025-3-22 12:06:33
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出没
发表于 2025-3-22 14:25:47
le according to “Moore‘s Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. .978-1-4939-4710-2978-1-4939-2163-8
DNR215
发表于 2025-3-22 20:32:01
978-1-4939-4710-2Springer Science+Business Media New York 2015
PLAYS
发表于 2025-3-23 00:19:03
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小争吵
发表于 2025-3-23 05:19:55
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Eosinophils
发表于 2025-3-23 05:43:20
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