incompatible
发表于 2025-3-21 16:53:15
书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0638399<br><br> <br><br>书目名称Molecular Modeling and Multiscaling Issues for Electronic Material Applications读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0638399<br><br> <br><br>
永久
发表于 2025-3-21 22:04:18
Book 2012electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved
杂色
发表于 2025-3-22 01:03:06
including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal condu978-1-4899-8837-9978-1-4614-1728-6
Kaleidoscope
发表于 2025-3-22 08:02:53
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作呕
发表于 2025-3-22 12:31:41
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
护航舰
发表于 2025-3-22 14:02:09
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DIKE
发表于 2025-3-22 19:49:19
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Cuisine
发表于 2025-3-22 22:47:11
https://doi.org/10.1007/978-1-4614-1728-6Atomistic scale; Electronic Materials; Molecular Modeling; Multiscale Modeling; Quantum Mechanics
溃烂
发表于 2025-3-23 05:05:02
978-1-4899-8837-9Springer Science+Business Media, LLC 2012
过份
发表于 2025-3-23 05:56:10
Nancy Iwamoto,Matthew M.F. Yuen,Haibo FanDiscusses multiscale modeling of materials at the mesoscale.Covers atomistic modeling of mechanical properties.Provides practical examples for engineers interested in molecular modeling using simulati