麻烦 发表于 2025-3-21 19:25:18

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深陷 发表于 2025-3-21 22:57:21

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揉杂 发表于 2025-3-22 03:13:13

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FILLY 发表于 2025-3-22 05:30:27

https://doi.org/10.1007/978-981-13-3627-0Flexible electronics; Electronic packaging; Transfer printing; Laser-assisted transfer; Picking-up and p

皮萨 发表于 2025-3-22 10:16:08

Science Press and Springer Nature Singapore Pte Ltd. 2019

Celiac-Plexus 发表于 2025-3-22 15:30:35

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夹克怕包裹 发表于 2025-3-22 17:57:26

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hypnotic 发表于 2025-3-23 00:42:29

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山间窄路 发表于 2025-3-23 04:34:02

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pulse-pressure 发表于 2025-3-23 09:16:15

deling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. .978-981-13-3627-0
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查看完整版本: Titlebook: Modeling and Application of Flexible Electronics Packaging; YongAn Huang,Zhouping Yin,Xiaodong Wan Book 2019 Science Press and Springer Na