连续不断
发表于 2025-3-21 18:31:25
书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0633423<br><br> <br><br>书目名称Microscale Heat Conduction in Integrated Circuits and Their Constituent Films读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0633423<br><br> <br><br>
Arb853
发表于 2025-3-21 23:42:27
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吗啡
发表于 2025-3-22 01:25:06
1389-2134 Overview: 978-1-4613-7374-2978-1-4615-5211-6Series ISSN 1389-2134
一加就喷出
发表于 2025-3-22 04:35:15
Review of Microscale Thermometry Techniques, these techniques are applicable for both device and material characterization while others are suitable only for device thermometry. This chapter reviews thermometry techniques for microdevices and microstructures. The techniques are categorized depending on whether they employ electrical or optical signals.
精致
发表于 2025-3-22 11:21:45
Thermal Properties of Amorphous Dielectric Films,m the basis of the techniques that measure the in- and out-of-plane thermal conductivity thermal conductivity and volumetric heat capacity heat capacity of thin dielectric films. The characterization capability is applied to the study of process-dependent thermal properties of silicon dioxide, which serves as a model amorphous solid.
轻推
发表于 2025-3-22 12:52:56
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pester
发表于 2025-3-22 19:21:42
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gustation
发表于 2025-3-22 21:48:04
Y. Sungtaek Ju Ph.D.,Kenneth E. Goodson Ph.D.ließt damit Geld zu, das der Kapitalmarkt derzeit kaum bereitstellt, die anderen hoffen, durch die Unternehmenskooperation Innovationslücken schließen zu können. ..Markus Solf untersucht, ob das Modell "Finanzierung als Gegenleistung für zukünftige Forschungsergebnisse" eine Basis für langfristig er
debouch
发表于 2025-3-23 02:36:14
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rectum
发表于 2025-3-23 09:37:17
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