fluoroscopy
发表于 2025-3-25 07:08:51
High-Speed Measurement of Complex Shaped Parts by Laser Triangulation for In-Line Inspection,mances of a product. Geometrical deviations in manufacturing can cause waste of large quantities of energy. Testing of parts having freeform surfaces is a key activity during the development of products with better performances. Depending on the workpiece shape, its manufacturing process, and tolera
DUCE
发表于 2025-3-25 10:34:09
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Devastate
发表于 2025-3-25 14:36:23
Measurements in Additive Manufacturing, component assemblies can be manufactured and not least how to ensure that manufacturing quality is met. This chapter is an enchiridion that details the most commonly applied AM technologies, their existing standards, and what measurements and quality assurance methods that are most relevant for eac
衰老
发表于 2025-3-25 16:03:30
In-Line Measurement Technology and Quality Control,uarantee high-quality standards and prohibit waste within production. As an enabler for this, in-line measurement technology is to be implemented and applied in the production system in an effective manner. In this chapter, different types of in-line measurement technology are explained and structur
IVORY
发表于 2025-3-25 21:54:16
In-Process Measurement of Subwavelength Structures,s chapter focuses on optical measurement, which provides in-process evaluation of engineering microstructure surfaces beyond the diffraction limit. First, application of optical super-resolution using structured light illumination to semiconductor patterns inspection is shown. Second, a new type of
强制性
发表于 2025-3-26 02:55:23
Optical Scatterometry for Nanostructure Metrology, dimension metrology, has become one of the most important techniques for critical dimension (CD) and overlay metrology in semiconductor manufacturing over the past decades due to its inherent noncontact, nondestructive, time-effective, and relatively inexpensive merits over other metrology techniqu
观点
发表于 2025-3-26 06:50:12
Contact-Type Micro Thermal Sensor for Surface Defect Detection,ed surfaces such as bare semiconductor wafers, magnetic disks, and optical components, is important process to assure the quality of products. In this chapter, a surface defect detection method, in which defect detection is carried out in such a way that the existence of a surface defect on a target
inspired
发表于 2025-3-26 10:18:45
X-Ray Computed Tomography for Dimensional Metrology,ndustry. This chapter describes the state of the art, the main technical characteristics, and examples of applications of CT in industrial dimensional metrology. Although still in its youth, metrological CT offers unique solutions and provides several advantages in comparison to other coordinate mea
预示
发表于 2025-3-26 13:55:39
Uncertainty Estimation in Computational Tools in Metrology, or Made in China 2025 for China, Factories of the Future for France, etc., the measurement uncertainty needs a specific management in order to control the quality of the manufactured part. In this future digital world, where the software will have a central position in the verification of a specifi
盟军
发表于 2025-3-26 18:03:59
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