绑架 发表于 2025-3-28 18:28:53
On Imbedded Alternating Renewal Process for a Diffusion Semi-Markov Process on Interval with Unatta not have any infinite-value interval of stop. So unattainability of the boundaries is provided only because of changing the coefficient of shift. A limit theorem of the alternating renewal process is used to derive a limit distribution of this diffusion semi-Markov process.Crater 发表于 2025-3-28 22:05:01
,On Dynamic Fracture of One-Dimensional Elastic Chain,em consists of arbitrary but finite number of links and the first mass is supposed to be fixed. Two types of load are discussed: free oscillations of the initially uniformly stretched chain and loading the chain with a short deformation pulse. Both problems are solved analytically for an arbitrary nconformity 发表于 2025-3-29 02:58:56
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SiC/Si as a New Platform for Growth of Wide-Bandgap Semiconductors,Institute for Problems in Mechanical Engineering (IPME RAS). We present the results on the developed growth method of thin silicon carbide films on silicon by coordinated atomic substitution, the properties of the obtained SiC/Si layers, and the prospects for their use as substrates for the growth oInordinate 发表于 2025-3-29 10:36:48
http://reply.papertrans.cn/63/6284/628400/628400_45.pngCAMEO 发表于 2025-3-29 13:48:47
http://reply.papertrans.cn/63/6284/628400/628400_46.png凝乳 发表于 2025-3-29 16:09:01
Research on Vibration Processes and Devices: New Results and Applications, achievement, a number of nonlinear vibration effects with a great potential for practical application have been discovered and studied. Moreover, new highly efficient vibration machines for the processing of natural and technogenic materials (crushers, screens, separators) and related laboratory an勉励 发表于 2025-3-29 23:20:32
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http://reply.papertrans.cn/63/6284/628400/628400_49.pngmitten 发表于 2025-3-30 06:19:44
clinically oriented, this book is designed to help primary and family medicine physicians improve the quality of women’s health care. .978-3-319-20077-4Series ISSN 2364-1150 Series E-ISSN 2364-1169