无意
发表于 2025-3-28 17:25:06
Shinji Takeda,Takashi Masuko,Nozomu Takano,Teiichi Inadat, travel, industry, telemedicine, disaster and emergency management. Data aggregation is key technique for power-efficient information acquisition in WSNs. However, data privacy during data aggregation is an important issue when the WSN is deployed in sensitive data applications, such as telemedici
Confirm
发表于 2025-3-28 22:34:20
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影响深远
发表于 2025-3-29 01:12:40
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胆大
发表于 2025-3-29 05:08:58
Katsuaki Suganuma Ph.D.,Jinting Jiu Ph.D.ty of service. This paradigm addresses the problems in cloud computing architecture by enabling lower latency, higher bandwidth, and better privacy and security. Previous studies of task allocation in MEC systems generally only consider the single influence factor, such as the distance between the m
incubus
发表于 2025-3-29 10:10:43
Michael Töpperility of applications, it also brings a series of resource waste and overhead issues. Therefore, the efficiency-first fault-tolerant algorithm (EFFT) with minimum execution cost in the cloud application is proposed. This algorithm minimizes the execution cost of the application under the constraints
Engaged
发表于 2025-3-29 15:28:00
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GRIN
发表于 2025-3-29 16:37:34
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patella
发表于 2025-3-29 23:25:13
Mark Porter,Robert Erich,Mark Ricotta streams. Although CNNs demonstrate the state-of-the-art detection accuracy, processing multiple video streams using such models in real-time imposes a serious challenge to the on-car computing systems. The lack of optimized system support, for example, could lead to a significant frame loss due to
悲观
发表于 2025-3-30 01:35:23
I-Chun Cheng Ph.D.nt direction of arrival (DOA) estimation algorithm. However, the extremely heavy computational complexity in the process of SML analysis restricts its application in practical systems. Aiming at this problem of SML, this paper proposes a parallel accelerating algorithm of membrane computing (MC), pa
ARCH
发表于 2025-3-30 06:13:02
3D Integration Technologies: An Overview, to overcome some physical, technological, and economic limits encountered in planar integrated circuits, extending Moore’s Law and enabling “More than Moore” applications. This chapter provides an overview of 3D integration technology, including review on its enabling technologies and the associate