摇晃 发表于 2025-4-1 05:13:23
http://reply.papertrans.cn/59/5886/588579/588579_61.png恶心 发表于 2025-4-1 08:05:36
http://reply.papertrans.cn/59/5886/588579/588579_62.pngflourish 发表于 2025-4-1 12:06:47
Compact EM Models for Multi-Segment Interconnect Wirestraight-line structure investigated in reliability analysis. However, obtaining analytical solutions for electromigration-induced stress evolution in general interconnect structure is extremely difficult (if not impossible).