摇晃 发表于 2025-4-1 05:13:23

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恶心 发表于 2025-4-1 08:05:36

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flourish 发表于 2025-4-1 12:06:47

Compact EM Models for Multi-Segment Interconnect Wirestraight-line structure investigated in reliability analysis. However, obtaining analytical solutions for electromigration-induced stress evolution in general interconnect structure is extremely difficult (if not impossible).
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查看完整版本: Titlebook: Long-Term Reliability of Nanometer VLSI Systems; Modeling, Analysis a Sheldon Tan,Mehdi Tahoori,Saman Kiamehr Book 2019 Springer Nature Swi