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发表于 2025-3-28 16:43:17
Alan McGibney,Sourabh Bhartiiated with sending signals through the BEOL interconnect begins to dominate the overall delay in the IC chip as seen in (Figure 2.1) . The first step towards reducing this delay is to find a suitable metal that has a lower resistivity than aluminum (Al) to replace it as the wiring metal. Of all t
枯萎将要
发表于 2025-3-28 19:47:15
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Essential
发表于 2025-3-29 01:34:00
0302-9743 digital twin engineering; digital thread in smart manufacturing; formal methods for distributed computing in future railway systems; industrial day..978-3-031-19761-1978-3-031-19762-8Series ISSN 0302-9743 Series E-ISSN 1611-3349
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小虫
发表于 2025-3-29 09:51:45
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Bumptious
发表于 2025-3-29 14:44:24
John Fitzgerald,Peter Gorm Larsen,Tiziana Margaria,Jim Woodcock,Cláudio Gomest really advanced, through the horsedrawn carriage and the sailing boat. Roads, canals and harbours could now be used for passenger and freight transport. Cities effected a mobilisation of manpower and communication over long distances in space and time, because of the developments in agricultural p
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intelligible
发表于 2025-3-29 21:35:44
Aaron John Buhagiar,Leo Freitas,William E. Scott III,Peter Gorm Larsenncreasing trend, primarily due to increasing travel demand globally. However, the travel demand and emission pattern varies widely across countries in the world. Even among OECD countries, significant differences can be observed in overall travel demand, choice of travel modes, and resulting loads o
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发表于 2025-3-30 02:37:35
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maladorit
发表于 2025-3-30 07:36:18
Tiziana Margaria,Dirk Pesch,Alan McGibneyals, packaging processes in advanced memory packaging.Explai.This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing...In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reli