线
发表于 2025-3-25 05:42:25
Lead-Free Wave Soldering,most challenging process to implement (together with lead-free BGA/CSP and PTH rework) and manufacturers around the world are challenged to qualify equipment and processes that will produce a quality lead-free product.
挡泥板
发表于 2025-3-25 10:58:46
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晚来的提名
发表于 2025-3-25 15:14:51
Backward and Forward Compatibility, industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and inv
Alveoli
发表于 2025-3-25 19:28:25
PCB Laminates,aminate materials used. The selection of laminate materials is more critical for achieving higher temperature lead-free solder alloy assembly yield targets and long term product reliability requirements. The SAC305 tin-silvercopper alloy (3.0 percent silver and 0.5 percent copper) recommended for le
intangibility
发表于 2025-3-25 21:22:19
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osteocytes
发表于 2025-3-26 04:11:33
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parasite
发表于 2025-3-26 07:38:58
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工作
发表于 2025-3-26 10:45:46
nt that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on developm978-1-4419-4083-4978-0-387-68422-2
退潮
发表于 2025-3-26 15:24:34
Carol Handwerker,Ursula Kattner,Kil-Won Moonen und Techniken) ergänzen die Beschreibung. Den abschließenden Schritt bilden 20 Erfolgsfaktoren des Change Managements..Das Zusammenspiel aus interdisziplinärer Grundlage, 6-Phasen-Modell mit Topics und Tools sowie Erfolgsfaktoren des Change Managements ist Voraussetzung für eine erfolgreichen Ver
convulsion
发表于 2025-3-26 20:25:37
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