赞美
发表于 2025-3-21 16:30:55
书目名称Lead-Free Electronic Solders影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0582217<br><br> <br><br>书目名称Lead-Free Electronic Solders读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0582217<br><br> <br><br>
kyphoplasty
发表于 2025-3-21 22:56:27
Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints underssing same geometry and prepared under the same conditions, indicate the important contributions of each of the service and material parameters, and the solder alloy composition, for reliability considerations.
precede
发表于 2025-3-22 01:58:15
nderstanding of the subject, the problems that still need to.In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However,
conference
发表于 2025-3-22 06:28:48
Sn-Zn low temperature solder,enables one to manufacture sound electronic products without any serious problems. The basic properties and the current understandings on the limit of the application of this solder are reviewed in this paper.
鼓掌
发表于 2025-3-22 09:38:15
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不可思议
发表于 2025-3-22 16:16:00
Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys,orphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.
GILD
发表于 2025-3-22 21:01:34
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群岛
发表于 2025-3-22 22:12:11
H. Ipser,H. Flandorfer,Ch. Luef,C. Schmetterer,U. Saeedxtbooks. Many conference proceedings on the subject have been produced that give excellent detail on research topics. However, the subject matter is rarely presented as a composite whole. New technology has broadened the scope of methods available for studying body temperature. Thermography in parti
analogous
发表于 2025-3-23 04:32:27
Sinn-Wen Chen,Chao-Hong Wang,Shih-Kang Lin,Chen-Nan Chiuany conference proceedings on the subject have been produced that give excellent detail on research topics. However, the subject matter is rarely presented as a composite whole. New technology has broadened the scope of methods available for studying body temperature. Thermography in particular has
是突袭
发表于 2025-3-23 09:21:20
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