上釉彩 发表于 2025-3-26 21:35:27
Jiang Hu,Sachin S. Sapatnekarout recourse to mathematics.Written in an approachable, info.The aim of this popular science text is to explain aerodynamic and astrodynamic flight without the use of mathematics, in an informal style, for non-technical readers who are interested in spaceflight and spacecraft...The book will open wiWorking-Memory 发表于 2025-3-27 03:03:10
John Lillisout recourse to mathematics.Written in an approachable, info.The aim of this popular science text is to explain aerodynamic and astrodynamic flight without the use of mathematics, in an informal style, for non-technical readers who are interested in spaceflight and spacecraft...The book will open wi树胶 发表于 2025-3-27 07:21:59
http://reply.papertrans.cn/59/5822/582142/582142_33.pngoptic-nerve 发表于 2025-3-27 11:19:05
http://reply.papertrans.cn/59/5822/582142/582142_34.pngObstreperous 发表于 2025-3-27 17:20:56
http://reply.papertrans.cn/59/5822/582142/582142_35.png并入 发表于 2025-3-27 21:38:09
Book 2001s inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mizatioverbearing 发表于 2025-3-28 00:25:19
http://reply.papertrans.cn/59/5822/582142/582142_37.pngJejune 发表于 2025-3-28 04:25:39
http://reply.papertrans.cn/59/5822/582142/582142_38.pngtackle 发表于 2025-3-28 10:19:20
Modeling and Characterization of IC Interconnects and Packagings for the Signal Integrity VerificatHowever, such an increase of integration level and speed raises the risk of poor noise margins and timing malfunctions during circuit operations. Therefore, when designing high performance VLSI circuits, very accurate design methodologies are required.丧失 发表于 2025-3-28 12:33:35
Non-Hanan Optimization for Global VLSI Interconnect,delay to dominate logic delay and become a significant bottleneck in VLSI system performance . As a result, many efforts have been carried out in recent years to improve the interconnect performance, and a good overview of these works is provided in .