hypothyroidism
发表于 2025-3-21 17:47:11
书目名称Introduction to Thermal Cloaking影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0474276<br><br> <br><br>书目名称Introduction to Thermal Cloaking读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0474276<br><br> <br><br>
Intend
发表于 2025-3-21 23:07:12
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Interdict
发表于 2025-3-22 03:16:39
Introduction,This chapter introduces the idea of a thermal cloak and presents the organization of the book materials.
phlegm
发表于 2025-3-22 04:54:30
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流眼泪
发表于 2025-3-22 10:37:30
,Review of Heat Conduction,This chapter reviews the fundamental theory of heat conduction, particularly in an anisotropic medium. Derivation of the heat conduction equation in an anisotropic medium is given, with specialization to an orthotropic solid.
BRAWL
发表于 2025-3-22 15:09:11
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CRACY
发表于 2025-3-22 18:56:42
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OVERT
发表于 2025-3-22 22:37:09
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钢笔记下惩罚
发表于 2025-3-23 02:58:02
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interrogate
发表于 2025-3-23 07:27:39
,Bilayer Theory for Conduction Thermal Cloaking,n detail. A new trilayer design based on the bilayer theory is given, and its improvement over the bilayer cloak is discussed. Finally, a general discussion on the feasibility of a bilayer design against arbitrary background temperature distributions is explored.