休耕地
发表于 2025-3-21 19:59:50
书目名称Interconnects in VLSI Design影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0470696<br><br> <br><br>书目名称Interconnects in VLSI Design读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0470696<br><br> <br><br>
Mobile
发表于 2025-3-22 00:18:51
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收到
发表于 2025-3-22 00:58:46
A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology,w challenges in keeping signal integrity on silicon and minimizing switching noise radiated from the IC and propagated into the exterior system. Since these effects are treated as ”parasitic“ and thus not covered by state-of-the-art design and simulation tools for VLSIs, the EMC team at Infineon Tec
Irritate
发表于 2025-3-22 06:01:08
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GAVEL
发表于 2025-3-22 12:31:30
Considering Magnetic Interference in Board-Level Interconnect Design,work simulator is presented. The method is well-suited for many low-frequency applications and in particular for circuit layout optimization purposes. Field-to-circuit coupling is described focussing on topological properties of the problem. After the electrical network is decomposed into tree and c
埋葬
发表于 2025-3-22 13:14:39
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ADAGE
发表于 2025-3-22 20:03:05
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perjury
发表于 2025-3-23 00:24:47
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惩罚
发表于 2025-3-23 03:27:05
Advanced Modeling of Nonuniform Interconnects, based on a weak formulation of the Nonuniform Multiconductor Transmission Lines (NMTL) equations through expansion and testing with suitable basis functions sets. Depending on the choice of these basis functions, it is possible to tune the behavior of the numerical scheme to the form of the expecte
慢慢流出
发表于 2025-3-23 08:50:51
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